CONN RCPT 30POS SMD GOLD
CONEXANT HSP AC LINK MODEM IC
类型 | 描述 |
---|---|
系列: | DF30 |
包裹: | Tape & Reel (TR) |
零件状态: | Last Time Buy |
连接器类型: | Receptacle, Outer Shroud Contacts |
职位数: | 30 |
沥青: | 0.016" (0.40mm) |
行数: | 2 |
安装类型: | Surface Mount |
特征: | Solder Retention |
接触完成: | Gold |
接触面厚度: | 2.00µin (0.051µm) |
配对堆叠高度: | 0.9mm |
离板高度: | 0.035" (0.88mm) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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