CONN HD ARRAY RCPT 300P SMD GOLD
MOTION CONTROL MODULE
IC QUADPLEXER B1+B3
类型 | 描述 |
---|---|
系列: | SEARAY™ SEAF |
包裹: | Tape & Reel (TR) |
零件状态: | Active |
连接器类型: | High Density Array, Female |
职位数: | 300 |
沥青: | 0.050" (1.27mm) |
行数: | 10 |
安装类型: | Surface Mount |
特征: | Board Guide, Pick and Place |
接触完成: | Gold |
接触面厚度: | 10.0µin (0.25µm) |
配对堆叠高度: | 8mm, 9mm, 9.5mm, 12.5mm, 13mm, 15mm, 17mm, 19mm |
离板高度: | 0.238" (6.05mm) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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