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MEMS OSC XO 48.0000MHZ LVCMOS LV
CONN HDR 10POS 0.1 STACK T/H TIN
CONN RCPT FMALE 16P SOLDER CUP
120G IB QDR CXP (300M)
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| 类型 | 描述 |
|---|---|
| 系列: | AMPMODU Mod II |
| 包裹: | Bulk |
| 零件状态: | Active |
| 职位数: | 10 |
| 沥青: | 0.100" (2.54mm) |
| 行数: | 1 |
| 行间距: | - |
| 长度 - 整体销: | 0.930" (23.622mm) |
| 长度 - 后（交配）: | 0.120" (3.050mm) |
| 长度 - 堆叠高度: | 0.700" (17.780mm) |
| 长尾: | 0.110" (2.800mm) |
| 安装类型: | Through Hole |
| 终止: | Solder |
| 接触完成 - 后（交配）: | Tin |
| 接触完成厚度 - 后（配合）: | 100.0µin (2.54µm) |
| 颜色: | Black |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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FW-35-04-F-D-250-120Samtec, Inc. |
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