IC CLK BUFFER 1:4 LVDS 24QFN
CONN HEADER SMD 26POS 2.54MM
类型 | 描述 |
---|---|
系列: | TSM |
包裹: | Tube |
零件状态: | Active |
连接器类型: | Header |
联系方式: | Male Pin |
俯仰交配: | 0.100" (2.54mm) |
职位数: | 26 |
行数: | 2 |
行距 - 交配: | 0.100" (2.54mm) |
加载的位置数: | All |
风格: | Board to Board or Cable |
笼罩: | Unshrouded |
安装类型: | Surface Mount |
终止: | Solder |
紧固类型: | Push-Pull |
接触长度 - 交配: | 0.120" (3.05mm) |
接触长度 - 后: | - |
总接触长度: | - |
绝缘高度: | 0.100" (2.54mm) |
接触形状: | Square |
接触完成 - 交配: | Gold |
接触表面厚度 - 配合: | 3.00µin (0.076µm) |
接触完成 - 发布: | Tin |
接触材料: | Phosphor Bronze |
绝缘材料: | Liquid Crystal Polymer (LCP) |
特征: | - |
工作温度: | -55°C ~ 125°C |
入口保护: | - |
材料可燃性等级: | UL94 V-0 |
绝缘颜色: | Black |
额定电流(安培): | - |
额定电压: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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