CAP FILM 0.033UF 20% 560VDC RAD
CONN RCPT 52POS 0.05 GOLD SMD
18P MQS PIN HOUSING
M HBEMPO T
类型 | 描述 |
---|---|
系列: | CLP |
包裹: | Tape & Reel (TR) |
零件状态: | Active |
连接器类型: | Receptacle |
联系方式: | Female Socket |
风格: | Board to Board |
职位数: | 52 |
加载的位置数: | All |
俯仰交配: | 0.050" (1.27mm) |
行数: | 2 |
行距 - 交配: | 0.050" (1.27mm) |
安装类型: | Surface Mount |
终止: | Solder |
紧固类型: | Push-Pull |
接触完成 - 交配: | Gold |
接触表面厚度 - 配合: | 10.0µin (0.25µm) |
绝缘颜色: | Black |
绝缘高度: | 0.084" (2.14mm) |
接触长度 - 后: | - |
工作温度: | -55°C ~ 125°C |
材料可燃性等级: | UL94 V-0 |
接触完成 - 发布: | Tin |
配对堆叠高度: | - |
入口保护: | - |
特征: | Board Guide, Pick and Place |
额定电流(安培): | 3.3A per Contact |
额定电压: | 240VAC, 330VDC |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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