FAST CURING THERMALLY CONDUCTIVE
CONN SOCKET 11P 0.05 GOLD SMD RA
类型 | 描述 |
---|---|
系列: | 851 |
包裹: | Bulk |
零件状态: | Active |
连接器类型: | Socket |
联系方式: | Female Socket |
风格: | Board to Board |
职位数: | 11 |
加载的位置数: | All |
俯仰交配: | 0.050" (1.27mm) |
行数: | 1 |
行距 - 交配: | - |
安装类型: | Surface Mount, Right Angle |
终止: | Solder |
紧固类型: | Push-Pull |
接触完成 - 交配: | Gold |
接触表面厚度 - 配合: | Flash |
绝缘颜色: | Black |
绝缘高度: | 0.087" (2.20mm) |
接触长度 - 后: | - |
工作温度: | -55°C ~ 125°C |
材料可燃性等级: | UL94 V-0 |
接触完成 - 发布: | Tin |
配对堆叠高度: | - |
入口保护: | - |
特征: | - |
额定电流(安培): | 1A |
额定电压: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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