类型 | 描述 |
---|---|
系列: | Textool™ |
包裹: | Bulk |
零件状态: | Active |
类型: | SOIC |
位置或引脚数(网格): | 16 (2 x 8) |
俯仰交配: | - |
接触完成 - 交配: | Gold |
接触表面厚度 - 配合: | - |
接触材料 - 配合: | Beryllium Copper |
安装类型: | Through Hole |
特征: | Closed Frame |
终止: | Solder |
投稿: | - |
接触完成 - 发布: | Gold |
接触完成厚度 - 后: | 30.0µin (0.76µm) |
联系材料 - 帖子: | Beryllium Copper |
筑屋材料: | Polyethersulfone (PES), Glass Filled |
工作温度: | -55°C ~ 150°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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