类型 | 描述 |
---|---|
系列: | 57 |
包裹: | Bulk |
零件状态: | Active |
类型: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
位置或引脚数(网格): | 24 (2 x 12) |
俯仰交配: | 0.100" (2.54mm) |
接触完成 - 交配: | Gold |
接触表面厚度 - 配合: | 10.0µin (0.25µm) |
接触材料 - 配合: | Beryllium Copper |
安装类型: | Through Hole |
特征: | Closed Frame |
终止: | Solder |
投稿: | 0.100" (2.54mm) |
接触完成 - 发布: | Gold |
接触完成厚度 - 后: | 10.0µin (0.25µm) |
联系材料 - 帖子: | Beryllium Copper |
筑屋材料: | Polyphenylene Sulfide (PPS), Glass Filled |
工作温度: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
![]() |
110-41-318-41-605000Mill-Max |
CONN IC SKT DBL |
![]() |
116-93-632-61-008000Mill-Max |
CONN IC SKT DBL |
![]() |
36-1508-30Aries Electronics, Inc. |
CONN IC DIP SOCKET 36POS GOLD |
![]() |
121-11-308-41-001000Mill-Max |
CONN IC SKT DBL |
![]() |
510-91-084-13-081002Mill-Max |
SKT PGA SOLDRTL |
![]() |
522-13-323-21-005003Mill-Max |
SKT PGA WRAPOST |
![]() |
146-43-640-41-013000Mill-Max |
CONN SKT DBL |
![]() |
551-10-089-13-061005Mill-Max |
CONN HDR SOLDRTL |
![]() |
110-41-652-61-001000Mill-Max |
CONN IC SKT DBL |
![]() |
210-83-306-41-101000Mill-Max |
CONN IC SKT DBL |
![]() |
85-PGM11007-11HAries Electronics, Inc. |
CONN SOCKET PGA GOLD |
![]() |
26-6820-90CAries Electronics, Inc. |
CONN IC DIP SOCKET 26POS GOLD |
![]() |
511-91-100-10-000003Mill-Max |
SKT PGA SOLDRTL |