RES 887 OHM 0.5% 1/3W 1206
HEATSINK 30X30X10MM L-TAB
IC MCU 16BIT 48KB FLASH 20LSSOP
IGBT 3 CHIP 600V WAFER
类型 | 描述 |
---|---|
系列: | - |
包裹: | Bulk |
零件状态: | Obsolete |
igbt型: | NPT |
电压 - 集电极发射极击穿(最大值): | 600 V |
电流 - 集电极 (ic) (max): | 50 A |
电流 - 集电极脉冲 (icm): | 150 A |
vce(on) (max) @ vge, ic: | 2.5V @ 15V, 50A |
功率 - 最大值: | - |
开关能量: | - |
输入类型: | Standard |
栅极电荷: | - |
td(开/关)@ 25°c: | 57ns/380ns |
测试条件: | 400V, 50A, 6.8Ohm, 15V |
反向恢复时间 (trr): | - |
工作温度: | -55°C ~ 150°C (TJ) |
安装类型: | Surface Mount |
包/箱: | Die |
供应商设备包: | Die |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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