RES SMD 2.61K OHM 1% 1/4W 1206
HEAT SINK COPPER DPAK TO-252
IC AMP CLASS D MONO 16CSP
类型 | 描述 |
---|---|
系列: | - |
包裹: | Bulk |
零件状态: | Active |
类型: | Top Mount |
包冷却: | TO-252 (DPak) |
附着方式: | SMD Pad |
形状: | Rectangular, Fins |
长度: | 0.320" (8.13mm) |
宽度: | 0.790" (20.07mm) |
直径: | - |
翅片高度: | 0.390" (9.91mm) |
功耗@温升: | - |
热阻@强制气流: | - |
热阻@自然: | 25.00°C/W |
材料: | Copper |
材料完成: | Tin |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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