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RES 3540 15K 1%
RES 1 OHM 2W 0.5% WW AXIAL
HEAT SINK 35MM X 35MM X 19.5MM
IC RLDRAM 1.125GBIT PAR 168BGA
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | BGA |
| 附着方式: | Thermal Tape, Adhesive (Included) |
| 形状: | Square, Fins |
| 长度: | 1.378" (35.00mm) |
| 宽度: | 1.378" (35.00mm) |
| 直径: | - |
| 翅片高度: | 0.768" (19.50mm) |
| 功耗@温升: | - |
| 热阻@强制气流: | 3.80°C/W @ 200 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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