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| 类型 | 描述 |
|---|---|
| 系列: | BDN |
| 包裹: | Box |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
| 附着方式: | Thermal Tape, Adhesive (Included) |
| 形状: | Square, Pin Fins |
| 长度: | 1.010" (25.65mm) |
| 宽度: | 1.010" (25.65mm) |
| 直径: | - |
| 翅片高度: | 0.355" (9.02mm) |
| 功耗@温升: | - |
| 热阻@强制气流: | 8.00°C/W @ 400 LFM |
| 热阻@自然: | 26.40°C/W |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
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HEATSINK 40X40X25MM R-TAB T412 |
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ATS-17G-135-C3-R0Advanced Thermal Solutions, Inc. |
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ATS-06F-72-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 45X45X35MM L-TAB T766 |
