HEATSINK 60X60X6MM XCUT T766
SOLDER PASTE WATER SOLUBLE 750GM
类型 | 描述 |
---|---|
系列: | pushPIN™ |
包裹: | Tray |
零件状态: | Active |
类型: | Top Mount |
包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
附着方式: | Push Pin |
形状: | Square, Fins |
长度: | 2.362" (60.00mm) |
宽度: | 2.362" (60.00mm) |
直径: | - |
翅片高度: | 0.236" (6.00mm) |
功耗@温升: | - |
热阻@强制气流: | 13.00°C/W @ 100 LFM |
热阻@自然: | - |
材料: | Aluminum |
材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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