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HEAT SINK, EXTRUSION, TO-218, 38
IC SRAM 32MBIT PARALLEL 48FBGA
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| 类型 | 描述 |
|---|---|
| 系列: | HSE |
| 包裹: | Box |
| 零件状态: | Active |
| 类型: | Board Level, Vertical |
| 包冷却: | TO-218 |
| 附着方式: | PC Pin |
| 形状: | Rectangular, Fins |
| 长度: | 1.500" (38.10mm) |
| 宽度: | 1.654" (42.00mm) |
| 直径: | - |
| 翅片高度: | 0.984" (25.00mm) |
| 功耗@温升: | 10.8W @ 75°C |
| 热阻@强制气流: | 2.29°C/W @ 200 LFM |
| 热阻@自然: | 6.94°C/W |
| 材料: | Aluminum Alloy |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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