类型 | 描述 |
---|---|
系列: | Fan Top |
包裹: | - |
零件状态: | Obsolete |
类型: | Top Mount |
包冷却: | TO-18 |
附着方式: | Press Fit |
形状: | Cylindrical |
长度: | - |
宽度: | - |
直径: | 0.500" (12.70mm) OD |
翅片高度: | 0.250" (6.35mm) |
功耗@温升: | - |
热阻@强制气流: | - |
热阻@自然: | 150.00°C/W |
材料: | Beryllium Copper |
材料完成: | Black Cadmium |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
7-120-BACTS Corporation |
HEATSINK PRESS ON .50"H BLK TO-5 |
|
ATS-PCB1020Advanced Thermal Solutions, Inc. |
HEATSINK TO-220 DUAL BLACK |
|
518-95AB-MS4Wakefield-Vette |
HEATSINK DC/DC HALF BRICK VERT |
|
ATS-PCB1022Advanced Thermal Solutions, Inc. |
HEATSINK TO-220 BLACK |
|
HS21Apex Microtechnology |
HEATSINK 6P DIP |
|
624-25ABT4Wakefield-Vette |
HEATSINK CPU 21MM SQ W/DBL TAPE |
|
658-60ABT4Wakefield-Vette |
HEATSINK CPU 27.9MM SQ W/ADH BLK |
|
HP1-TO3-CBCTS Corporation |
HEATSINK PWR .90"H BLACK TO-3 |
|
821102B00000Comair Rotron |
HEATSINK STAMP 9.5X13.2X19.1MM |
|
821102B04000Comair Rotron |
HEATSINK STAMP 9.5X13.2X19.1MM |
|
HS20Apex Microtechnology |
HEATSINK 10P/12P PWR SIP |
|
TG-CJ-12-12-10-PFt-Global Technology |
HEATSINK CER 12X12X10MM |
|
XL25-15-15-5t-Global Technology |
CERAMIC HEAT SPREADER 15X15MM GR |