English
简体中文
SMA-SP/SMA-SJ LMR24 36I
HEATSINK CPU 28MM SQ BLK W/TAPE
ERC-50-500 23.2K 1% T-2 EA E3
IC SUPERVISOR 1 CHANNEL SOT25
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | 658 |
| 包裹: | Bulk |
| 零件状态: | Obsolete |
| 类型: | Top Mount |
| 包冷却: | BGA |
| 附着方式: | Thermal Tape, Adhesive (Included) |
| 形状: | Square, Pin Fins |
| 长度: | 1.100" (27.94mm) |
| 宽度: | 1.100" (27.94mm) |
| 直径: | - |
| 翅片高度: | 0.250" (6.35mm) |
| 功耗@温升: | 2.0W @ 40°C |
| 热阻@强制气流: | 5.00°C/W @ 500 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
PA2-1CBCTS Corporation |
HEATSINK LOW PROFILE BLK TO-220 |
|
658-60ABT1Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE |
|
HS22Apex Microtechnology |
HEATSINK THERMALLOY 6025B |
|
TG-CJ-LI-30.5-30.5-6-PFt-Global Technology |
HEATSINK CER 30.5X30.5X6MM W/TAP |
|
833802T00000Comair Rotron |
HEATSINK STAMP 13.1X13.2X24MM |
|
ATS-61325W-C1-R0Advanced Thermal Solutions, Inc. |
MAXIGRIP FANSINK 32.5X24.5MM |
|
634-20ABPWakefield-Vette |
HEATSINK TO-220 VERT MT BLK 2.0" |
|
342946Aavid |
COPPER HEATSINK 60X60X22MM |
|
243-3PABWakefield-Vette |
HEATSINK TO-220 CLIP-ON BLK |
|
658-25ABT4Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE |
|
667-10ABPPWakefield-Vette |
HEATSINK TO-220 W/PINS |
|
ATS-PCB1039Advanced Thermal Solutions, Inc. |
HEATSINK TO-220 |
|
825902B05300Comair Rotron |
HEATSINK STAMP 24.1X48.3X23.6 |