SWITCH SLIDE SPDT 100MA 30V
HEATSINK 40X40X25MM R-TAB T766
1 GBPS POWERLINE WITH 802.11AC 2
类型 | 描述 |
---|---|
系列: | pushPIN™ |
包裹: | Tray |
零件状态: | Active |
类型: | Top Mount |
包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
附着方式: | Push Pin |
形状: | Square, Fins |
长度: | 1.575" (40.00mm) |
宽度: | 1.575" (40.00mm) |
直径: | - |
翅片高度: | 0.984" (25.00mm) |
功耗@温升: | - |
热阻@强制气流: | 4.14°C/W @ 100 LFM |
热阻@自然: | - |
材料: | Aluminum |
材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
ATS-55425D-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 42.5X42.5X9.5MM NO TIM |
|
AH00119V02750CEOhmite |
HEATSINK, FLAT BACK 2.75" |
|
ATS-18B-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
901-19-2-15-2-B-0Wakefield-Vette |
HEAT SINK PIN FIN 19X19MM CLIP |
|
ATS-10H-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
TGH-0250-01t-Global Technology |
ALUMINIUM HEAT SINK 25X25MM |
|
ATS-20E-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
HSIB898-BGA-1iBASE Technology |
AC, HEAT SPREADER FOR IB898, (RO |
|
ATS-X51230R-C1-R0Advanced Thermal Solutions, Inc. |
MAXIFLOW 22.25X22.25X19.5MM T766 |
|
529901B00000Aavid |
BOARD LEVEL HEAT SINK |
|
341900F00000GAavid |
HEATSINK |
|
2-1542006-3TE Connectivity AMP Connectors |
HS 21MM ASSY ULTEM CL |
|
519903B00000GAavid |
BOARD LEVEL HEAT SINK |