类型 | 描述 |
---|---|
系列: | 907 |
包裹: | Box |
零件状态: | Active |
类型: | Top Mount |
包冷却: | BGA |
附着方式: | Push Pin |
形状: | Square, Pin Fins |
长度: | 1.299" (33.00mm) |
宽度: | 1.299" (32.99mm) |
直径: | - |
翅片高度: | 0.693" (17.60mm) |
功耗@温升: | - |
热阻@强制气流: | 2.69°C/W @ 200 LFM |
热阻@自然: | 10.50°C/W |
材料: | Aluminum |
材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
![]() |
HSIB905-PGA-1iBASE Technology |
AC, HEATSPEADER FOR IB905F, (ROH |
![]() |
335814B00000GAavid |
HEAT SINK |
![]() |
ATS-18B-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
ATS-11H-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
ATS-10B-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
680-5220Wakefield-Vette |
HEATSINK TO-220 OMNIDIRECT BLK |
![]() |
PICOHEATSINKKITTechNexion |
PICO HEATSINK + THERMAL PAD + SC |
![]() |
ATS-55330R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 33X33X19.5MM W/OUT TIM |
![]() |
ATS-17B-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
624-60ABT1EWakefield-Vette |
HEATSINK FOR 21MM BGA |
![]() |
321127B00000Aavid |
BOARD LEVEL HEAT SINK |
![]() |
908-35-2-28-2-B-0Wakefield-Vette |
HEAT SINK PIN FIN 35X35MM CLIP |
![]() |
ATS-52450P-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 45X45X17.5MM W/OUT TIM |