English
简体中文
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | pushPIN™ |
| 包裹: | Tray |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
| 附着方式: | Push Pin |
| 形状: | Square, Fins |
| 长度: | 1.575" (40.00mm) |
| 宽度: | 1.575" (40.00mm) |
| 直径: | - |
| 翅片高度: | 0.984" (25.00mm) |
| 功耗@温升: | - |
| 热阻@强制气流: | 9.39°C/W @ 100 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
533522B02552GAavid |
BOARD LEVEL HEAT SINK |
|
|
TXB2P045037BCTS Corporation |
THERMAL LINK PRESS ON BLK TO-8 |
|
|
625-45ABT1EWakefield-Vette |
HEATSINK FOR 25MM BGA |
|
|
ATS-13F-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
HSIB903-BGAiBASE Technology |
AC, HEATSINK + FAN FOR IB903F/ I |
|
|
658-35ABT1EWakefield-Vette |
HEATSINK CPU 28MM SQBLK W/O TAPE |
|
|
DA-T263-301E-TROhmite |
HEATSINK D2PAK TO-263 ANODIZED |
|
|
ATS-11G-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-15G-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
ATS-55290K-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 29X29X14.5MM W/OUT TIM |
|
|
490-35KWakefield-Vette |
HEATSINK KING SIZE HIGH PWR RECT |
|
|
ATS-19G-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
527-24AB-MET725Wakefield-Vette |
HEATSINK DC/DC HALF BRICK VERT |
