类型 | 描述 |
---|---|
系列: | pushPIN™ |
包裹: | Tray |
零件状态: | Active |
类型: | Top Mount |
包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
附着方式: | Push Pin |
形状: | Square, Fins |
长度: | 1.575" (40.00mm) |
宽度: | 1.575" (40.00mm) |
直径: | - |
翅片高度: | 0.984" (25.00mm) |
功耗@温升: | - |
热阻@强制气流: | 4.14°C/W @ 100 LFM |
热阻@自然: | - |
材料: | Aluminum |
材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
![]() |
ATS-15D-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
321127B00000GAavid |
HEATSINK |
![]() |
698-100ABWakefield-Vette |
HEATSINK EXTRUSION 45MM |
![]() |
903-23-2-21-2-B-0Wakefield-Vette |
HEAT SINK PIN FIN 23X23MM CLIP |
![]() |
ATS-20H-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
ATS-01G-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
ATS-08D-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
TGH-0075-01t-Global Technology |
ALUMINIUM HEAT SINK 7.5X7.5MM |
![]() |
132-11B9Wakefield-Vette |
HEATSINK EXTRUDED |
![]() |
2268BAavid |
BOARD LEVEL HEAT SINK |
![]() |
C400K25ROhmite |
400W 25 OHMS VIT CORRIB 10% |
![]() |
642-25ABT5Wakefield-Vette |
HEATSINK FOR 35MM BGA |
![]() |
ATS-12B-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |