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| 类型 | 描述 |
|---|---|
| 系列: | * |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | - |
| 包冷却: | - |
| 附着方式: | - |
| 形状: | - |
| 长度: | - |
| 宽度: | - |
| 直径: | - |
| 翅片高度: | - |
| 功耗@温升: | - |
| 热阻@强制气流: | - |
| 热阻@自然: | - |
| 材料: | - |
| 材料完成: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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6400B-P2GAavid |
BOARD LEVEL HEAT SINK |
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ATS-52170G-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 17X17X12.5MM W/OUT TIM |
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286-CTEWakefield-Vette |
HEATSINK FOR TO220 |
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ATS-EXL104-1220-R0Advanced Thermal Solutions, Inc. |
HEATSINK AL6063 1220X108X34.3MM |
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TGH-0450-01t-Global Technology |
ALUMINIUM HEAT SINK 45X45MM |
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ATS-21G-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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2286BGAavid |
HEATSINK |
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ATS-09D-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
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125545Wakefield-Vette |
7WX36" EXTRUSION 16235 XX5733 |
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HSET860-BGA-1iBASE Technology |
HEATSINK FOR ET860(H051HSET860B0 |
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ATS-11H-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
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ATS-09C-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
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133-5G9Wakefield-Vette |
HEATSINK EXTRUDED |
