类型 | 描述 |
---|---|
系列: | 901 |
包裹: | Box |
零件状态: | Active |
类型: | Top Mount |
包冷却: | BGA |
附着方式: | Push Pin |
形状: | Square, Pin Fins |
长度: | 0.394" (10.00mm) |
宽度: | 0.394" (10.00mm) |
直径: | - |
翅片高度: | 0.693" (17.60mm) |
功耗@温升: | - |
热阻@强制气流: | 5.97°C/W @ 200 LFM |
热阻@自然: | 11.40°C/W |
材料: | Aluminum |
材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
133-10BWakefield-Vette |
HEATSINK EXTRUDED |
|
303MMWakefield-Vette |
HEATSINK COMPACT |
|
6273BAavid |
BOARD LEVEL HEAT SINK |
|
6038DGAavid |
BOARD LEVEL HEAT SINK |
|
ATS-11F-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
660-29ABT1EWakefield-Vette |
HEATSINK EXTRUSION 37MM |
|
ATS-54210D-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 21X21X9.5MM W/OUT TIM |
|
ATS-06F-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
XL25W-12-12-10t-Global Technology |
CERAMIC HEAT SINK 12X12X10MM WHI |
|
ATS-21F-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
2-1542007-3TE Connectivity AMP Connectors |
HEAT SINK BGA 29MM 3FIN RADIAL |
|
655-26ABT1EWakefield-Vette |
HEATSINK FOR 40MM BGA |
|
563202B00000GAavid |
BOARD LEVEL HEAT SINK |