类型 | 描述 |
---|---|
系列: | - |
包裹: | Bulk |
零件状态: | Active |
类型: | - |
包冷却: | - |
附着方式: | - |
形状: | - |
长度: | - |
宽度: | - |
直径: | - |
翅片高度: | - |
功耗@温升: | - |
热阻@强制气流: | - |
热阻@自然: | - |
材料: | - |
材料完成: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
![]() |
ATS-14D-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
ATS-08H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
ATS-14A-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
642-45ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
![]() |
ATS-02H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
ATS-EXL119-1220-R0Advanced Thermal Solutions, Inc. |
PCIE EXTRUSION PROFILE, AL6063 |
![]() |
625-60ABT4EWakefield-Vette |
HEATSINK FOR 25MM BGA |
![]() |
ATS-06F-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
7121DGAavid |
BOARD LEVEL HEAT SINK |
![]() |
ATS-EXL67-1220-R0Advanced Thermal Solutions, Inc. |
HEATSINK AL6063 1220X27.5X13.5MM |
![]() |
B60-075-VEOhmite |
HEATSINK FOR TO-247 TO-264 |
![]() |
630-25ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
![]() |
PH3N-100-100-0.07-1At-Global Technology |
PH3N 100X100X0.07MM W/ADH |