类型 | 描述 |
---|---|
系列: | 669 |
包裹: | Bulk |
零件状态: | Active |
类型: | Top Mount |
包冷却: | SPGA |
附着方式: | Clip, Thermal Material |
形状: | Square, Pin Fins |
长度: | 1.700" (43.18mm) |
宽度: | 1.700" (43.18mm) |
直径: | - |
翅片高度: | 0.315" (8.00mm) |
功耗@温升: | 5.0W @ 40°C |
热阻@强制气流: | 5.00°C/W @ 100 LFM |
热阻@自然: | - |
材料: | Aluminum |
材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
![]() |
HSIB903-BGA-2iBASE Technology |
AC, HEAT SPREADER FOR IB903F / I |
![]() |
286-DBEWakefield-Vette |
HEATSINK TO-220 VERTICAL |
![]() |
906-31-1-15-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 31X31MM CLIP |
![]() |
ATS-15G-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
ATS-52210G-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 21X21X12.5MM W/OUT TIM |
![]() |
ATS-07G-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
531002B02100GAavid |
BOARD LEVEL HEAT SINK |
![]() |
624-60ABWakefield-Vette |
HEATSINK FOR 21MM BGA |
![]() |
ATS-11A-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
40480Vicor |
BOM ASSEMBLY 3623 XF PUSH PIN |
![]() |
910-40-2-21-2-B-0Wakefield-Vette |
HEAT SINK PIN FIN 40X40MM CLIP |
![]() |
533502B12552GAavid |
BOARD LEVEL HEATSINK W/THRM TAPE |
![]() |
ATS-21F-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |