English
简体中文
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | pushPIN™ |
| 包裹: | Tray |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
| 附着方式: | Push Pin |
| 形状: | Square, Fins |
| 长度: | 1.575" (40.00mm) |
| 宽度: | 1.575" (40.00mm) |
| 直径: | - |
| 翅片高度: | 0.984" (25.00mm) |
| 功耗@温升: | - |
| 热阻@强制气流: | 4.14°C/W @ 100 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
667-15ABSPEWakefield-Vette |
HEATSINK TO-220 W/S/O PINS BLK |
|
|
560200B00000GAavid |
BOARD LEVEL HEAT SINK |
|
|
V6534B-TASSMANN WSW Components |
HEATSINK ALUM ANOD |
|
|
ATS-18B-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
ATS-52300B-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 30X30X7.5MM W/OUT TIM |
|
|
ATS-52310P-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 31X31X17.5MM W/OUT TIM |
|
|
ATS-54325R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 32.5X32.5X19.5MM NO TIM |
|
|
253-122ABE-22Wakefield-Vette |
HEATSINK LOW PROFILE |
|
|
D10850-40T4EWakefield-Vette |
HEATSINK 128PQFP COMPOSITE |
|
|
ATS-06E-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-54210W-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 21X21X24.5MM W/OUT TIM |
|
|
ATS-20D-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
7178DGAavid |
BOARD LEVEL HEAT SINK |
