English
简体中文
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | 301 |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Board Level, Vertical |
| 包冷却: | Stud Mounted Semiconductor Cases |
| 附着方式: | Press Fit |
| 形状: | Rectangular, Fins |
| 长度: | 2.000" (50.80mm) |
| 宽度: | 0.750" (19.05mm) |
| 直径: | - |
| 翅片高度: | 2.000" (50.80mm) |
| 功耗@温升: | 15.0W @ 70°C |
| 热阻@强制气流: | 2.50°C/W @ 250 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum Alloy |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
XL25W-TO264-28-22-1t-Global Technology |
CERAMIC HEAT SPREADER 28X22MM WH |
|
|
ATS-05E-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
ATS-20C-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
625-45ABT3Wakefield-Vette |
HEATSINK CPU 25MM SQ W/DBL TAPE |
|
|
ATS-17C-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
|
667-25ABPPEWakefield-Vette |
HEATSINK TO-220 W/S/O PINS BLK |
|
|
905-29-1-15-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 29X29MM CLIP |
|
|
ATS-EXL118-1220-R0Advanced Thermal Solutions, Inc. |
PCIE EXTRUSION PROFILE, AL6063 |
|
|
528-24AB-MET725Wakefield-Vette |
HEATSINK DC/DC HALF BRICK VERT |
|
|
907-33-1-23-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 33X33MM CLIP |
|
|
ATS-18D-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-08A-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
|
ATS-EXL120-1220-R0Advanced Thermal Solutions, Inc. |
PCIE EXTRUSION PROFILE, AL6063 |
