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IC RAM 2MBIT PARALLEL 44TSOP2
HEATSINK STAMP 22.9X8X10.2MM
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| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Bulk |
| 零件状态: | Obsolete |
| 类型: | Top Mount |
| 包冷却: | TO-252 (DPak) |
| 附着方式: | SMD Pad |
| 形状: | Rectangular, Fins |
| 长度: | 0.315" (8.00mm) |
| 宽度: | 0.900" (22.86mm) |
| 直径: | - |
| 翅片高度: | 0.400" (10.16mm) |
| 功耗@温升: | 2.5W @ 35°C |
| 热阻@强制气流: | 17.50°C/W @ 300 LFM |
| 热阻@自然: | - |
| 材料: | Copper |
| 材料完成: | Tin |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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