THERM PAD 39.37MMX26.67MM W/ADH
IC MCU 16BIT 32KB FLASH 44QFN
CONN PLUG FMALE 39POS GOLD CRIMP
IC MCU 8/16BIT 128KB FLSH 64VQFN
类型 | 描述 |
---|---|
系列: | Ti900 |
包裹: | Bulk |
零件状态: | Active |
用法: | TO-3 |
类型: | Die-Cut Pad, Sheet |
形状: | Rhombus |
大纲: | 39.37mm x 26.67mm |
厚度: | 0.0050" (0.127mm) |
材料: | Silicone |
粘合剂: | Adhesive - Both Sides |
后盾,载体: | Viscose |
颜色: | White |
热电阻率: | - |
导热系数: | 1.8W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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