THERM PAD 21.84MMX18.8MM BEIGE
SOLDER SPHERES 63/37 .020 DIAM
IC RF TXRX+MCU BLUETOOTH 50XFBGA
FILLER PANEL,FLAT,W/DBL'D'3UX7HP
类型 | 描述 |
---|---|
系列: | Sil-Pad® K-10 |
包裹: | Bulk |
零件状态: | Active |
用法: | TO-218, TO-220, TO-247 |
类型: | Pad, Sheet |
形状: | Rectangular |
大纲: | 21.84mm x 18.80mm |
厚度: | 0.0060" (0.152mm) |
材料: | Silicone Rubber |
粘合剂: | - |
后盾,载体: | Polyimide |
颜色: | Beige |
热电阻率: | - |
导热系数: | 1.3W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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