IC EEPROM 16KBIT I2C 8SOIC
TFLEX HD3140MTG 17.5X18"
类型 | 描述 |
---|---|
系列: | Tflex™ HD300 |
包裹: | Bulk |
零件状态: | Active |
用法: | - |
类型: | Gap Filler Pad, Sheet |
形状: | Rectangular |
大纲: | 457.20mm x 444.50mm |
厚度: | 0.140" (3.56mm) |
材料: | Silicone, Ceramic Filled |
粘合剂: | Tacky - Both Sides |
后盾,载体: | Liner |
颜色: | Pink |
热电阻率: | - |
导热系数: | 2.7W/m-K |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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