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THERMAL INTERFACE PAD, GAP PAD,
EE PLD, 2.3NS, PAL-TYPE, CMOS
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| 类型 | 描述 |
|---|---|
| 系列: | * |
| 包裹: | Bulk |
| 零件状态: | Active |
| 可编程型: | - |
| 延迟时间 tpd(1) 最大值: | - |
| 电压供应 - 内部: | - |
| 逻辑元件/块的数量: | - |
| 宏单元数: | - |
| 门数: | - |
| 输入/输出数: | - |
| 工作温度: | - |
| 安装类型: | - |
| 包/箱: | - |
| 供应商设备包: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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