类型 | 描述 |
---|---|
系列: | ProASIC3 |
包裹: | Tray |
零件状态: | Active |
实验室/俱乐部数量: | - |
逻辑元件/单元的数量: | - |
总内存位: | 36864 |
输入/输出数: | 151 |
门数: | 250000 |
电压 - 电源: | 1.425V ~ 1.575V |
安装类型: | Surface Mount |
工作温度: | -40°C ~ 100°C (TJ) |
包/箱: | 208-BFQFP |
供应商设备包: | 208-PQFP (28x28) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
XC3S1000-5FGG456CXilinx |
IC FPGA 333 I/O 456FBGA |
|
M2GL005-1VF256Roving Networks / Microchip Technology |
IC FPGA 161 I/O 256FBGA |
|
XC7S6-2FTGB196IXilinx |
IC FPGA 100 I/O 196CSBGA |
|
LCMXO2-2000HE-5FTG256ILattice Semiconductor |
IC FPGA 206 I/O 256FTBGA |
|
A42MX36-BG272MRoving Networks / Microchip Technology |
IC FPGA 202 I/O 272BGA |
|
M1AGL1000V2-FGG144Roving Networks / Microchip Technology |
IC FPGA 97 I/O 144FBGA |
|
10AX066N3F40I2SGIntel |
IC FPGA 588 I/O 1517FCBGA |
|
5CEBA9F27C8NIntel |
IC FPGA 336 I/O 672FBGA |
|
10AX027E2F29I2SGIntel |
IC FPGA 360 I/O 780FBGA |
|
XC3S200-5FT256CXilinx |
IC FPGA 173 I/O 256FTBGA |
|
EP2A25F672C7Rochester Electronics |
EP2A25F67 - APEX II PLD |
|
LCMXO3L-4300C-6BG256ILattice Semiconductor |
IC FPGA 206 I/O 256CABGA |
|
A3P1000-FG256TRoving Networks / Microchip Technology |
IC FPGA 177 I/O 256FBGA |