THERM PAD 19.05MMX12.7MM PINK
FPGA, 400 CLBS, 7000 GATES, 111M
CONN IC DIP SOCKET 32POS GOLD
类型 | 描述 |
---|---|
系列: | XC4000E/X |
包裹: | Bulk |
零件状态: | Active |
实验室/俱乐部数量: | 400 |
逻辑元件/单元的数量: | 950 |
总内存位: | - |
输入/输出数: | 160 |
门数: | - |
电压 - 电源: | 4.5V ~ 5.5V |
安装类型: | Surface Mount |
工作温度: | -40°C ~ 100°C (TJ) |
包/箱: | 225-BBGA |
供应商设备包: | 225-PBGA (27x27) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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