RES 0.075 OHM 5% 25W DPAK
IC FPGA 512 I/O 1517FCBGA
MEGAPAC STD 4KW
类型 | 描述 |
---|---|
系列: | Kintex® UltraScale+™ |
包裹: | Tray |
零件状态: | Active |
实验室/俱乐部数量: | 37320 |
逻辑元件/单元的数量: | 653100 |
总内存位: | 53964800 |
输入/输出数: | 512 |
门数: | - |
电压 - 电源: | 0.698V ~ 0.876V |
安装类型: | Surface Mount |
工作温度: | 0°C ~ 100°C (TJ) |
包/箱: | 1517-BBGA, FCBGA |
供应商设备包: | 1517-FCBGA (40x40) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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