类型 | 描述 |
---|---|
系列: | MAX® 10 |
包裹: | Tray |
零件状态: | Active |
实验室/俱乐部数量: | 1563 |
逻辑元件/单元的数量: | 25000 |
总内存位: | 691200 |
输入/输出数: | 101 |
门数: | - |
电压 - 电源: | 2.85V ~ 3.465V |
安装类型: | Surface Mount |
工作温度: | -40°C ~ 125°C (TJ) |
包/箱: | 144-LQFP Exposed Pad |
供应商设备包: | 144-EQFP (20x20) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
EP3C16U484C6NIntel |
IC FPGA 346 I/O 484UBGA |
|
LCMXO3D-4300HC-5BG256CLattice Semiconductor |
IC FPGA MACHXO3D 4300LUT 256BGA |
|
LFXP2-30E-5FN484CLattice Semiconductor |
IC FPGA 363 I/O 484FBGA |
|
A54SX32-1TQG144Roving Networks / Microchip Technology |
IC FPGA 113 I/O 144TQFP |
|
10AX090N2F45I2LGIntel |
IC FPGA 768 I/O 1932FCBGA |
|
LCMXO2-2000HC-6TG100ILattice Semiconductor |
IC FPGA 79 I/O 100TQFP |
|
EP3CLS150F780C7NIntel |
IC FPGA 413 I/O 780FBGA |
|
M2GL025T-FG484Roving Networks / Microchip Technology |
IC FPGA 267 I/O 484FBGA |
|
XC3S700A-4FGG400CXilinx |
IC FPGA 311 I/O 400FBGA |
|
10AX016E3F27E1HGIntel |
IC FPGA 240 I/O 672FBGA |
|
XC3S400AN-4FT256CXilinx |
IC FPGA 195 I/O 256FTBGA |
|
A3P1000-FG256MRoving Networks / Microchip Technology |
IC FPGA 177 I/O 256FBGA |
|
XC6SLX100-3CSG484IXilinx |
IC FPGA 338 I/O 484CSBGA |