类型 | 描述 |
---|---|
系列: | ECP2 |
包裹: | Tray |
零件状态: | Active |
实验室/俱乐部数量: | 2625 |
逻辑元件/单元的数量: | 21000 |
总内存位: | 282624 |
输入/输出数: | 193 |
门数: | - |
电压 - 电源: | 1.14V ~ 1.26V |
安装类型: | Surface Mount |
工作温度: | 0°C ~ 85°C (TJ) |
包/箱: | 256-BGA |
供应商设备包: | 256-FPBGA (17x17) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
10AX090N1F45I1SGIntel |
IC FPGA 768 I/O 1932FCBGA |
|
LCMXO3D-4300HC-5BG256ILattice Semiconductor |
IC FPGA MACHXO3D 4300LUT 256BGA |
|
EP2C8T144C8NIntel |
IC FPGA 85 I/O 144TQFP |
|
LCMXO2-256ZE-2UMG64ILattice Semiconductor |
IC FPGA 44 I/O 64UCBGA |
|
XA7A25T-1CSG325QXilinx |
IC FPGA 150 I/O 325CSBGA |
|
5CGXFC4C7F27C8NIntel |
IC FPGA 336 I/O 672FBGA |
|
EP3C25F256C6Intel |
IC FPGA 156 I/O 256FBGA |
|
MPF200T-FCG784IRoving Networks / Microchip Technology |
IC FPGA 364 I/O 784FCBGA |
|
APA075-PQG208Roving Networks / Microchip Technology |
IC FPGA 158 I/O 208QFP |
|
XC3S50-5VQG100CXilinx |
IC FPGA 63 I/O 100VQFP |
|
5CGXFC4C6M13C6NIntel |
IC FPGA 175 I/O 383MBGA |
|
EPF10K100ABI356-2NRochester Electronics |
LOADABLE PLD, 0.7NS PBGA356 |
|
M1AFS600-2FG484IRoving Networks / Microchip Technology |
IC FPGA 172 I/O 484FBGA |