类型 | 描述 |
---|---|
系列: | Fusion® |
包裹: | Tray |
零件状态: | Active |
实验室/俱乐部数量: | - |
逻辑元件/单元的数量: | - |
总内存位: | 276480 |
输入/输出数: | 119 |
门数: | 1500000 |
电压 - 电源: | 1.425V ~ 1.575V |
安装类型: | Surface Mount |
工作温度: | 0°C ~ 85°C (TJ) |
包/箱: | 256-LBGA |
供应商设备包: | 256-FPBGA (17x17) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
10CX085YF672E5GIntel |
IC FPGA 212 I/O 672FBGA |
|
XCKU095-1FFVB1760IXilinx |
IC FPGA 702 I/O 1760FCBGA |
|
5SGXEA3K2F35C3GIntel |
IC FPGA 432 I/O 1152FBGA |
|
5SGXMB5R2F40I2GIntel |
IC FPGA 432 I/O 1517FBGA |
|
1SG085HN3F43E3VGASIntel |
IC FPGA STRATIX 10 1760FBGA |
|
M2GL050TS-FGG896IRoving Networks / Microchip Technology |
IC FPGA 377 I/O 896FBGA |
|
M2GL050T-FCS325Roving Networks / Microchip Technology |
IC FPGA 200 I/O 325BGA |
|
XCVU190-3FLGC2104EXilinx |
IC FPGA 416 I/O 2104FCBGA |
|
XCVU095-2FFVB1760IXilinx |
IC FPGA 702 I/O 1760FCBGA |
|
AX2000-1LG624MRoving Networks / Microchip Technology |
IC FPGA 418 I/O 624CLGA |
|
5AGXBB7D6F40C6GIntel |
IC FPGA 704 I/O 1517FBGA |
|
A3P250-2FG144Roving Networks / Microchip Technology |
IC FPGA 97 I/O 144FBGA |
|
5AGZME7H2F35C3GIntel |
IC FPGA 534 I/O 1152FBGA |