THERM PAD 33.32MMX19.35MM BEIGE
IC FPGA 744 I/O 1152FBGA
类型 | 描述 |
---|---|
系列: | * |
包裹: | Tray |
零件状态: | Active |
实验室/俱乐部数量: | - |
逻辑元件/单元的数量: | - |
总内存位: | - |
输入/输出数: | - |
门数: | - |
电压 - 电源: | - |
安装类型: | - |
工作温度: | - |
包/箱: | - |
供应商设备包: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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