HEATSINK 70X70X10MM XCUT T766
CONN HEADER SMD R/A 15POS 2MM
IC FPGA 97 I/O 144FBGA
类型 | 描述 |
---|---|
系列: | ProASIC3 |
包裹: | Tray |
零件状态: | Active |
实验室/俱乐部数量: | - |
逻辑元件/单元的数量: | - |
总内存位: | 110592 |
输入/输出数: | 97 |
门数: | 600000 |
电压 - 电源: | 1.425V ~ 1.575V |
安装类型: | Surface Mount |
工作温度: | -40°C ~ 100°C (TJ) |
包/箱: | 144-LBGA |
供应商设备包: | 144-FPBGA (13x13) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
1SG280HN3F43I1VGASIntel |
IC FPGA STRATIX 10 1760FBGA |
|
5AGXBA3D6F27C6GIntel |
IC FPGA 336 I/O 672FBGA |
|
5SGXEA7K2F40C2GIntel |
IC FPGA 696 I/O 1517FBGA |
|
M1A3PE3000L-FGG484IRoving Networks / Microchip Technology |
IC FPGA 341 I/O 484FBGA |
|
5SGSMD4K2F40I2LGIntel |
IC FPGA 696 I/O 1517FBGA |
|
5SGXMBBR3H43I4GIntel |
IC FPGA 600 I/O 1760HBGA |
|
M2GL025TS-VF400Roving Networks / Microchip Technology |
IC FPGA 207 I/O 400VFBGA |
|
EP4SE360F35C3GIntel |
IC FPGA 744 I/O 1152FBGA |
|
OR2C12A4S304-DBRochester Electronics |
FPGA, 324 CLBS, 15600 GATES |
|
5SGXEA5H3F35C4GIntel |
IC FPGA 552 I/O 1152FBGA |
|
XCVU31P-2FSVH1924EXilinx |
IC FPGA VIRTEX UP 1924SBGA |
|
XCVU13P-2FSGA2577EXilinx |
IC FPGA VIRTEX UP 2577SBGA |
|
5SGXEBBR2H43C3GIntel |
IC FPGA 600 I/O 1760HBGA |