HEATSINK 45X45X12.7MM XCUT
UP-ANGLE CAT6 GIGABIT MOLDED SLI
IC MCU 32BIT 2MB FLASH 236FBGA
类型 | 描述 |
---|---|
系列: | XLF |
包裹: | Tray |
零件状态: | Active |
核心处理器: | XCore |
核心尺寸: | 32-Bit 12-Core |
速度: | 2000MIPs |
连通性: | - |
外围设备: | - |
输入/输出数: | 128 |
程序内存大小: | 2MB (2M x 8) |
程序存储器类型: | FLASH |
eeprom大小: | - |
内存大小: | 256K x 8 |
电压 - 电源 (vcc/vdd): | 0.95V ~ 3.6V |
数据转换器: | - |
振荡器类型: | External |
工作温度: | -40°C ~ 85°C (TA) |
安装类型: | Surface Mount |
包/箱: | 236-LFBGA |
供应商设备包: | 236-FBGA (10x10) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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