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THERM PAD 5MMX5MM WHITE
HEATSINK 45X45X35MM R-TAB T766
SUPERGRIP HEATSINK 31X31X17.5MM
IC MCU 32BIT ROMLESS 256MAPBGA
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| 类型 | 描述 |
|---|---|
| 系列: | MCF5445x |
| 包裹: | Tray |
| 零件状态: | Active |
| 核心处理器: | Coldfire V4 |
| 核心尺寸: | 32-Bit |
| 速度: | 180MHz |
| 连通性: | I²C, SPI, SSI, UART/USART, USB OTG |
| 外围设备: | DMA, WDT |
| 输入/输出数: | 132 |
| 程序内存大小: | - |
| 程序存储器类型: | ROMless |
| eeprom大小: | - |
| 内存大小: | 32K x 8 |
| 电压 - 电源 (vcc/vdd): | 1.35V ~ 3.6V |
| 数据转换器: | - |
| 振荡器类型: | Internal |
| 工作温度: | -40°C ~ 85°C (TA) |
| 安装类型: | Surface Mount |
| 包/箱: | 256-LBGA |
| 供应商设备包: | 256-MAPBGA (17x17) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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