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IC I.MX 8M PLUS QUAD BGA
HEAT SHRINK
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| 类型 | 描述 |
|---|---|
| 系列: | i.MX8ML |
| 包裹: | Tray |
| 零件状态: | Active |
| 核心处理器: | ARM® Cortex®-A53 |
| 核心数/总线宽度: | 4 Core, 64-Bit |
| 速度: | 1.8GHz |
| 协处理器/DSP: | ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP |
| 内存控制器: | DDR4, LPDDR4 |
| 图形加速: | Yes |
| 显示和界面控制器: | HTML, LVDS, MIPI-CSI, MIPI-DSI |
| 以太网: | GbE (2) |
| 数据: | - |
| USB: | USB 2.0 + PHY (2), USB 3.0 + PHY (2) |
| 电压 - I/O: | - |
| 工作温度: | -40°C ~ 105°C (TJ) |
| 安全功能: | ARM TZ, CAAM, RDC |
| 包/箱: | 486-LFBGA |
| 供应商设备包: | 486-LFBGA (14x14) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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