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IC COMPARATOR DUAL HI SPD 14SOIC
POWERQUICC RISC MICROPROCESSOR
RF SHLD COVER 0.705"X0.933" SNAP
DREMEL PLA 3D PRINTER FILAMENT,
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| 类型 | 描述 |
|---|---|
| 系列: | MPC8xx |
| 包裹: | Bulk |
| 零件状态: | Active |
| 核心处理器: | MPC8xx |
| 核心数/总线宽度: | 1 Core, 32-Bit |
| 速度: | 50MHz |
| 协处理器/DSP: | Communications; CPM |
| 内存控制器: | DRAM |
| 图形加速: | No |
| 显示和界面控制器: | - |
| 以太网: | 10Mbps (1), 10/100Mbps (1) |
| 数据: | - |
| USB: | - |
| 电压 - I/O: | 3.3V |
| 工作温度: | 0°C ~ 105°C (TA) |
| 安全功能: | - |
| 包/箱: | 357-BBGA |
| 供应商设备包: | 357-PBGA (25x25) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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