RES SMD 13K OHM 0.25% 1/8W 0805
FIXED IND 720NH 10.5A 11.6 MOHM
IC MCU 8BIT 4KB FLASH 20SSOP
CORE 3.6G 8M 1151P 4CORE I7-7700
类型 | 描述 |
---|---|
系列: | Kaby Lake |
包裹: | Tray |
零件状态: | Discontinued at Digi-Key |
核心处理器: | I7-7700 |
核心数/总线宽度: | 4 Core, 64-Bit |
速度: | 3.6GHz |
协处理器/DSP: | - |
内存控制器: | - |
图形加速: | No |
显示和界面控制器: | - |
以太网: | - |
数据: | - |
USB: | - |
电压 - I/O: | - |
工作温度: | - |
安全功能: | - |
包/箱: | 1151-LGA Module |
供应商设备包: | 1151-FCLGA (37.5x37.5) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
96MPXEB-2.1-20M20TAdvantech |
XEON 2.1G 20M 2011P 8CORE 85W |
|
IDT79RV4640-150DUGRenesas Electronics America |
IC MPU MIPS-I 150MHZ 128QFP |
|
XLP316XD1600-20Broadcom |
1428 FCBGA+HS 40X40MM |
|
BCM58622BA0KF12GBroadcom |
INTEGRATED CPU WITH 5-PORT ETH |
|
EP7312-CBZCirrus Logic |
IC MPU EP7 74MHZ 256BGA |
|
BCM47081SL01Broadcom |
2+3 GE WLAN CHIPSET(11N+11AC) |
|
TSPC603RVGS8LCRoving Networks / Microchip Technology |
IC MPU 603E 200MHZ 255CICBGA |
|
BCM47081SE03Broadcom |
2+2 GE WLAN CHIPSET(11N+11AC) |
|
T2080NXN7MQBNXP Semiconductors |
IC SOC 64BIT 8X1.2GHZ 896FCBGA |
|
ATSAMA5D23B-CURRoving Networks / Microchip Technology |
IC MCU 32BIT 196TFBGA |
|
IDT79RV4640-200DUGRenesas Electronics America |
IC MPU MIPS-I 200MHZ 128QFP |
|
BCM58522BB0KF10GBroadcom |
DUAL CORE |
|
MC7448VS600NCNXP Semiconductors |
IC MPU MPC74XX 600MHZ 360FCCLGA |