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| 类型 | 描述 |
|---|---|
| 系列: | SmartFusion®2 |
| 包裹: | Tray |
| 零件状态: | Active |
| 建筑学: | MCU, FPGA |
| 核心处理器: | ARM® Cortex®-M3 |
| 闪存大小: | 256KB |
| 内存大小: | 64KB |
| 外围设备: | DDR, PCIe, SERDES |
| 连通性: | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| 速度: | 166MHz |
| 主要属性: | FPGA - 60K Logic Modules |
| 工作温度: | -40°C ~ 100°C (TJ) |
| 包/箱: | 676-BGA |
| 供应商设备包: | 676-FBGA (27x27) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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