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DS75 DIGITAL THERMOMETER AND THE
IC SOC CORTEX-M3 100MHZ 256FBGA
RX TXRX MODULE 802.15.4 CHIP SMD
0970 PSL 123
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| 类型 | 描述 |
|---|---|
| 系列: | SmartFusion® |
| 包裹: | Tray |
| 零件状态: | Active |
| 建筑学: | MCU, FPGA |
| 核心处理器: | ARM® Cortex®-M3 |
| 闪存大小: | 256KB |
| 内存大小: | 64KB |
| 外围设备: | DMA, POR, WDT |
| 连通性: | EBI/EMI, Ethernet, I²C, SPI, UART/USART |
| 速度: | 100MHz |
| 主要属性: | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
| 工作温度: | -40°C ~ 100°C (TJ) |
| 包/箱: | 256-LBGA |
| 供应商设备包: | 256-FPBGA (17x17) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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