类型 | 描述 |
---|---|
系列: | * |
包裹: | Bulk |
零件状态: | Active |
类型: | - |
输入类型: | - |
输出类型: | - |
供电: | - |
工作温度: | - |
安装类型: | - |
包/箱: | - |
供应商设备包: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
ZSSC3026CI6CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSC31050FICRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC3154BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
AD9976BCPZRLRochester Electronics |
IC PROCESSOR CCD 14BIT LFCSP |
|
ZSSC3131BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC3170FE1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSC31015EACRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC4165DE1DRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
ZSSC3036CC1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSSC3026CI1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3036CC1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3170EE1DRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
ZSC31014EABRenesas Electronics America |
WAFER (UNSAWN) - BOX |