类型 | 描述 |
---|---|
系列: | * |
包裹: | Tray |
零件状态: | Active |
类型: | - |
输入类型: | - |
输出类型: | - |
供电: | - |
工作温度: | - |
安装类型: | - |
包/箱: | - |
供应商设备包: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
ZSSC3015NE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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ZSSC3016CI1BPRenesas Electronics America |
WAFER (UNSAWN) - BOX |
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ZSSC5101BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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MAX32664GWEB+TMaxim Integrated |
CORTEX M4F 96MHZ ME11, WLP, ALGO |
|
TDC-GP30YA-F01 1KScioSense |
TDC-GP30YA-F01 1K QFN40 LF T&R |
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ZSSC3135BA1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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ZSC31014EACRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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ZSSC3026CC1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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ZSSC3154BA1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
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ZSSC3131BA1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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ZSSC3135BE1BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
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ZSC31014EICRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
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ZSC31010CEBRenesas Electronics America |
WAFER (UNSAWN) - BOX |