SYSTEM BASIS CHIP,LIN, 2X 5.0 V/
MULTI-PURPOSE KIT HG 2620 E HEAT
类型 | 描述 |
---|---|
系列: | - |
包裹: | Bulk |
零件状态: | Active |
应用: | System Basis Chip |
界面: | CAN, LIN |
电压 - 电源: | 5.5V ~ 28V |
包/箱: | 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
供应商设备包: | 32-SOIC-EP |
安装类型: | Surface Mount |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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