类型 | 描述 |
---|---|
系列: | µModule® |
包裹: | Tray |
零件状态: | Active |
技术: | Magnetic Coupling |
类型: | SPI |
隔离电源: | Yes |
通道数: | 6 |
输入 - 侧 1/侧 2: | 3/3 |
渠道类型: | Unidirectional |
电压 - 隔离: | 2500Vrms |
共模瞬态抗扰度 (min): | 30kV/µs |
数据速率: | 4MHz, 8MHz |
传播延迟 tplh / tphl (max): | 100ns, 100ns |
脉宽失真(最大值): | - |
上升/下降时间(典型值): | 3ns, 3ns |
电压 - 电源: | 4.5V ~ 5.5V |
工作温度: | -40°C ~ 85°C |
安装类型: | Surface Mount |
包/箱: | 32-BBGA |
供应商设备包: | 32-BGA (15x11.25) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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